Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: Dymax Trigger Cure
Edited by the Electronicstalk Editorial
Team on 15 September 2003
Potting compound is transparent to RF
Dymax Trigger Cure is a novel potting compound available from Intertronics.
Dymax Trigger Cure is a novel potting compound available from Intertronics Unlike other urethane and epoxy materials that absorb and block radio-frequency signals, Trigger Cure transmits signals in both the cured and uncured state
This article was originally published on Electronicstalk on 2 Apr 2001 at 8.00am (UK)
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UV curing adhesives bond to 3000psi
According to UK distributor Intertronics, Dymax Series 800 adhesives form bonds to 3000psi on metal, ferrite, ceramic and glass surfaces.
This facilitates immediate QA testing for the circuit, even before completion of gel time.
This new two-part product is designed for ease of application through normal, disposable tip static mix dispensers.
After it is dispensed, exposure to long wave UV light cures the product to a depth of 6mm in 20s or less.
The material forms a tough, UV cured top layer providing protection and integrity to the surface.
The remaining, interior liquid resin gels in 7 to 20min, with no exotherm, to a very soft material that protects and cushions delicate parts through additional depth.
The product is capable of gelling at room temperature, to depths of at least 25mm and in areas under components where the light does not reach in 20min or less.
Optimum properties are achieved in 48h at room temperature.
Dymax Trigger Cure combines the fast curing benefits of light curing products with the chemical cure of traditional potting compounds, allowing for potting applications to be automated and eliminating the need for curing racks or an offline heat curing process.
As well as providing good environmental resistance, adhesion to substrates and a tough outer surface, Dymax two-part UV potting compounds form a resilient low-stress protective encapsulant around delicate parts found below the UV cured surface.
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