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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: Dymax 9008
Edited by the Electronicstalk Editorial Team on 24 March 2004

Fast-curing encapsulant maintains
flexibility

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Curing in seconds on exposure to UV/visible light, Dymax 9008 encapsulant exhibits excellent adhesion to polyimide, enduring bending and flexing even at extremes of thermal cycling to -20C.

Curing in seconds on exposure to UV/visible light, Dymax 9008 encapsulant exhibits excellent adhesion to polyimide, enduring bending and flexing even at extremes of thermal cycling to -20C The cured coating forms a transparent layer that protects components and leads from moisture, dust and other contaminants

Dymax 9008 is formulated to dispense consistently through precision dispensing systems.

Controlled placement optimises the process and minimises resin consumption.

The flow characteristics of Dymax 9008 are designed to assure coverage of leads of even large surface mount components, without running to areas where protection is not needed.

The coating cures in 10 to 30s under standard long-wave, moderate or high-intensity lights (200-1200mW/cm2).

The length of exposure depends on the light used and thickness of the coating.

However, thicknesses to 1.5mm can be cured in UV conveyor belts at speeds of 60 to 120cm/min or under spot lamps in a few seconds.

Cure depths to 6.5mm are possible.

Like other Dymax coatings, 9008 is a tough, durable resin with excellent electrical properties.

It has high ionic purity as well as the ability to withstand harsh environmental conditions.

Coatings form protective surfaces and exhibit adhesion to a wide variety of surfaces including glass-filled epoxy, metal and ceramic surfaces as well as polyimide and other flex materials.

Because 9008 is highly flexible - even at very low temperatures - the encapsulant provides superior protection where rugged conditions are the rule.

Intertronics supplies a complete line of complementary curing and dispensing systems as part of its adhere solutions range.

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