Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: Techspray No Clean Wick
Edited by the Electronicstalk Editorial
Team on 23 May 2005
Desoldering braid answers Pb-free
process demands
Available now from Intertronics, Techspray No Clean Wick is a new formulation that has been tested by the UK National Physical Laboratory.
Available now from Intertronics, Techspray No Clean Wick is a new formulation that has been tested by the UK National Physical Laboratory Transferring to lead-free soldering has raised a number of practical issues for the electronics manufacturing industry, all of which must be addressed if implementation of the new technology is to be realised
This article was originally published on Electronicstalk on 2 Apr 2001 at 8.00am (UK)
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One such issue relates to the rework and repair of joints soldered with lead-free materials, in which the higher temperatures involved can place demands on both the materials and the process window.
Building on its experience of making a range of desoldering braids, Techspray has developed a patented wick compatible with the higher temperatures required to rework/repair lead-free joints.
The result is a copper braid/flux combination, which does not char and has a wider processing window than traditional counterparts, leaving minimal residues on the board.
The efficiency and stability of the flux has been tested independently by the National Physical Laboratory.
The independent cleanliness testing (to ISO9455-17) by NPL showed excellent stable, repeatable and high SIR measurements.
Techspray No-Clean Wick leaves little, if any, residue affecting SIR levels.
Microscopic examination of the test PCBs showed no dendrites.
The desoldering braid is the cleanest, and will give the most reliable desoldering results.
Also Techspray No-Clean Wick is rosin free, colophony free, and does not give off a rosin fume.
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