Product category:
PCB Assembly Equipment and Tools
News Release from: Intertronics | Subject: PCB049
Edited by the Electronicstalk Editorial
Team on 23 March 2006
Kit offers easy intro to mixed lead-free
assembly
The new PCB049 board and kit is billed as the ultimate resource for evaluating mixed-technology lead-free assembly.
The new PCB049 board and kit is billed as the ultimate resource for evaluating mixed-technology lead-free assembly This "do-everything" kit allows companies to test a wide variety of JEDEC and EIAJ components
This article was originally published on Electronicstalk on 12 Jun 2006 at 8.00am (UK)
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Board and kit ease lead-free evaluation
The new PCB049 board and kit - developed by Practical Components in conjunction with Indium Corp - is billed as the ultimate resource for evaluating mixed-technology lead-free assembly.
Pens dispense without a squeeze
Fisnar Flow-Seal pens from Intertronics allow the controlled application of both water and alcohol-based products including no-clean liquid fluxes, RMA liquid fluxes and solvents.
UV curing adhesives bond to 3000psi
According to UK distributor Intertronics, Dymax Series 800 adhesives form bonds to 3000psi on metal, ferrite, ceramic and glass surfaces.
It has been put together by Indium Corp and Practical Components.
The PCB049 board used to evaluate solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance, and wave flux hole fill performance.
Additionally, the board helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors, and lead-free underfill performance.
Each Practical Components test kit includes a copy of CircuitCAM and CheckPoint software, ready-to-run CircuitCAM project files (CPFs), assembly documentation samples and templates, installation instructions, and user manual.
As the Practical Components distributor for the UK, Intertronics now supplies the AIM print test board and kit that was designed to include many printing challenges commonly encountered on manufacturers' assemblies.
In addition to BGA and microBGA pads, both have circular and square pad designs to test paste release.
AIM has included the standard IPC slump test pattern in order to further challenge the properties of any product tested.
This print pattern is more "real life" and can more accurately predict slump since individual pads are used as opposed to one pad that is common in the "thermometer" method.
There is a number on the board indicating the distances between pads, ensuring that a hard number can be used for paste evaluations.
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components.
These pads have varying distances between them, allowing users to determine paste solder beading.
Four 250 x 250mil pads are available for use with various aperture styles to allow for wetting tests.
There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
Board material is FR4 170Tg with a standard ImAg finish.
Additionally, the kit is available with lead-free components.
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