Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: 4-20418-VT Ultra Light-Weld adhesive system
Edited by the Electronicstalk Editorial
Team on 15 May 2008
Adhesives meet RFID needs
The 4-20418-VT Ultra Light-Weld adhesive system is used to apply opaque tags to light-transmissible spacers that are then affixed to polycarbonate, ABS or metals.
The move to component RFID (radio frequency identification) is generating large quantities of highly variable adhesive requirements, especially for harsh environments in industries as diverse as clothing, military, cosmetics and electronics where high-value units need rapid identification Dymax has designed a specialised UV adhesive process that has been developed to provide robust adhesion on a variety of opaque substrates
This article was originally published on Electronicstalk on 2 Apr 2001 at 8.00am (UK)
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The 4-20418-VT Ultra Light-Weld adhesive system is used to apply opaque tags to light-transmissible spacers that are then affixed to polycarbonate, ABS or metals to achieve a difficult-to-remove bond.
The flexible, economically viable and fully portable on-site spot curing RFID bonding process has been designed as an environmentally-friendly solution to be used during assembly or in field applications by warehouses, subcontractors, or office personnel.
Use of UV adhesive for RFID application improves security, loss-prevention, item traceability and logistics by replacing labour-intensive manual paperwork tracking systems and/or other methods that rely on serial number labels or tapes and human intervention.
Ultra Light-Weld UV adhesive for RFID applications performs well despite temperature fluctuations, including warehouse storage, ambient operating environments and wide range thermocycling experienced during transportation and/or field use.
The easily set-up, portable BlueWave 50 UV light curing units feature 5mm spot lightguides for bonding this "on-demand" cure adhesive in all normal industrial environments.
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