Configurable buffers meet new DDR2 specifications

Configurable registered buffers with parity checking ease the design of higher throughput memory modules for highly reliable high-performance server and workstation applications.

An active leader in the JEDEC standards organisation, Inphi Corporation not only assisted in defining the latest DDR2 specification, but aggressively designed and delivered the world's first parts meeting the specification's latest speed grade, DDR2-800, a magnitude of performance improvement over previously defined standards.

The new B32865, B32868 and B32869 configurable registered buffers with parity checking, fully support the AMD platform, and are designed to facilitate the design of higher throughput memory modules for highly reliable, high-performance server and workstation applications.

Part of the highly reliable ExacTik family, these new parts together with Inphi's popular B32866 form the world's first complete solution to meet or exceed all current JEDEC DDR2 standards from 400 to 800Mbit/s.

"Our customers' need access to components that meet the industry's latest specifications virtually as soon as the specs are approved".

"These new parts highlight Inphi's commitment to working closely with JEDEC and our customers, to rapidly integrate newly defined standards, capitalise on our technology and manufacturing expertise, and deliver the world's highest precision solutions", said John Smolka, Director of Applications for Inphi and JEDEC JC40 Committee Chairman.

"These new ExacTik components dramatically extend Inphi's market lead, making Inphi the world's only logic vendor to deliver all registers for DDR2 across the full range of defined speed grades of 400, 533, 667 and 800Mbit/s enabling the highest performance systems".

The only solutions currently available for DDR2-800, Inphi's new configurable buffers fully deliver a significantly higher throughput than DDR2-400 and DDR2-533 solutions.

Recognising manufacturers migrate their solutions to higher levels of performance over time, Inphi designed these new parts to deliver full performance across the complete range of JEDEC-defined speed grades, from DDR2-400 through DDR2-800.

This backward compatibility ensures the B32865, B32868 and B32869 deliver the performance manufacturers' need whether designing with older, slower DRAMs or using the industry's fastest memory parts, not only simplifying design but also reducing the number of parts manufacturers must stock.

By designing the parts to exceed the JEDEC specification, Inphi's components deliver a higher module yield resulting in a reduction of manufacturing costs.

The B32865 exceeds all JESD82-9 performance specifications through DDR2-533 rates, and the B32868 provide the same performance defined in JESD82-14 for DDR2-400 and DDR2-533.

Both of these new parts also exceed the JESDxx-x performance specifications up to DDR2-667 rates.

The B32869 exceeds the defined specification, JESD-82-12, for both DDR2-400 and DDR2-533, as well as the JESDxx-x for DDR2-400, DDR2-533, and DDR2-667.

Each of the new DDR2-800 configurable buffers complies with DDR2 SDRAM over/undershoot specification defined in JESD79-2.

The parts feature pull-down resistors on all data and parity inputs, latch-up protection, and exceed JESD78 class 2.

All new components include ESD protection that exceeds JESD22.

The parts' single die design ensures manufacturers will realise some of the industry's lowest input capacitance.

The B32865 supports RDIMM module D and other similarly configured modules, the B32868 supports RDIMM modules K and M, and the B32869 supports RDIMM module L.

The new B32865 (INSSTUB32865) is available in a 160-ball TFBGA package, the B32868 (INSSTUB32868) in a 176-ball TFBGA package, and the B32869 (INSSTUB32869), in a 150 ball TFBGA package.

All three parts are expected to be priced at $3.90 in 10,000-unit quantities.

All three components are available in lead-free or "green" packages.

Parts and evaluation boards are available immediately.

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