Product category:
Intellectual Property Cores
News Release from: inSilicon Corp
Edited by the Electronicstalk Editorial
Team on 21 June 2002
Agilent comes to inSilicon for USB IP
Agilent Technologies has signed an agreement for inSilicon to supply its USB 2.0 PHY IP to Agilent's Semiconductor Products Group.
Agilent Technologies has signed an agreement for inSilicon to supply its USB 2.0 PHY IP to Agilent's Semiconductor Products Group Certified by the USB Implementer's Forum, inSilicon's USB 2 PHY is a complete mixed-signal semiconductor IP solution designed for single-chip Hi-Speed USB 2.0 integration in both device and host applications
This article was originally published on Electronicstalk on 18 Jan 2001 at 8.00am (UK)
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The USB 2 PHY integrates high-speed, mixed-signal, custom CMOS circuitry in compliance with the industry-standard UTMI Specification.
USB 2 PHY technology supports the USB 2.0 480Mbit/s protocol and data rate, and is backward compatible with the USB 1.1 legacy protocol at 1.5 and 12Mbit/s.
The inSilicon/Agilent agreement defines foundry process ports beginning with inSilicon providing their Hi-Speed USB 2.0 PHY targeted to a 0.13-micron process.
In the future, as more advanced semiconductor processes become available, the agreement provides for the relationship to be extended.
"We're seeing increased customer interest in the USB 2.0 high-speed interconnect standard", said Jeff Henderson, vice president and general manager of Agilent's Hard Copy Division.
"We're confident that inSilicon will help us provide Agilent customers with a superior USB 2.0 connectivity solution that is certified to be interoperable".
``We're pleased to see increased industry adoption of Hi-Speed USB 2.0 as demonstrated by this agreement between InSilicon and Agilent,'' said Jason Ziller, chairman of the USB-IF and Intel technology initiatives manager.
"Consumers realise the performance benefits of Hi-Speed USB 2.0 in printers, CD and DVD burners, scanners, cameras and hard drives".
"Agilent's decision to choose our USB 2 PHY for their USB 2.0 connectivity needs validates the robustness of our product", said Xerxes Wania, vice president of mixed-signal business of inSilicon Corp.
"This partnership allows Agilent to focus its engineering resources on other aspects of their system-level chip designs, resulting in lower costs and faster time to market".
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