Process makes RF relays more economical

Xcom and IMT have implemented an effective wafer manufacturing process to produce die in high volumes at low cost.

Xcom Wireless and Innovative Micro Technology have reached a critical milestone in producing their RF MEMS relay product.

Xcom and IMT have implemented an effective wafer manufacturing process to produce die in high volumes at low cost.

Xcom and IMT have automated wafer-level testing, established critical process controls, and enhanced temperature tolerance for soldering.

Xcom is now sampling SPDT RF MEMS relays for size-constrained and performance-critical applications in automated test equipment, RF instrumentation, and military and civilian radios.

"We are extremely pleased with the progress the team has made in process enhancements and yield", says Dr Dan Hyman, CEO of Xcom.

"Our products are now qualified; as volumes ramp, we are confident that IMT will continue to be a great manufacturing partner with the highest levels of quality and support".

IMT CEO Dr John Foster adds: "IMT has partnered with Xcom to overcome the many challenges of taking their design from development and prototyping to volume production".

"We believe Xcom's products will take a leadership position in a variety of RF applications".

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