Connectors support AdvancedTCA and MicroTCA

In2Connect now offers world beating AMC connectors from ept for AdvancedTCA and MicroTCA applications.

MicroTCA defines systems that accommodate plugs-in cards complying with the established Advanced Mezzanine Card (AMC) specification developed by the PCIMG (a consortium of over 450 companies that collaboratively develop open specifications for high performance telecomms and industrial computing applications).

These cards, which were originally designed as daughter boards plug straight into a MicroTCA system backplane.

The specification incorporates the system management and fabric features from AdvancedTCA into a platform which is scaleable from small, cost effective systems to highly available, packet based redundant systems.

MicroTCA brings the robustness and reliability of the AdvancedTCA approach to market segments requiring a small footprint; such as access and edge applications in telecomms networks and applications like medical, security, industrial control and military.

In2Connect now offers world beating AMC connectors from ept, which include: AdvancedTCA AMC B+ connectors; AdvancedTCA female backplane connectors; AdvancedTCA male connectors; MicroTCA connectors; MicroTCA power backplane connectors; and MicroTCA power module output connectors.

With AdvancedTCA and MicroTCA signal connectors having 170 contacts on a pitch of 0.75mm, the specification ATCA 3.0 demands very tight tolerances for the mating PCB tracks, such that PC board manufacturers are currently up against the limits of cost-effective production.

This makes the choice of suitable connectors of decisive importance.

At the 2006 Electronica trade fair, ept and Harting exhibited their new products in the AdvancedTCA and MicroTCA arena.

In a unique working relationship the connectors have been developed jointly by both companies to have identical mechanical and electrical features; however production and sales take place separately, so the user can choose between two independent supply sources and at the same time profit from the cumulative core competencies of both companies.

A year after co-operation began and the AdvancedMC connectors were successfully introduced, the two companies have now launched con:card+, a quality seal which identifies an improved generation of connectors and a rocket science reduction in time to market.

As AMC connectors must accept the maximum width tolerance of the AMC module, the offset of the axis of symmetry of PCB pad and connector contact of an AMC card of "nominal" width of 65mm can be as high as 0.075mm.

An AMC card of minimum width would allow a 0.125mm offset.

The core element of the new con:card+ connectors is the patented GuideSpring.

The GuideSpring mitigates symmetry offsets by constantly pressing the AMC module against the opposite wall of the connector.

The con:card+ connector is optimised so that an AdvancedMC module with nominal width can mate with zero symmetry offset.

Even in a worst case scenario the GuideSpring achieves an overlap of PCB pad and contact of over 90%.

The GuideSpring has the added benefit of securing the module position against shock and vibrations, thus preventing loss of contact and surface wear.

This assists the use of boards that can be produced cost-effectively by current series production methods.

The GuideSpring is an excellent solution, but is only one of five advantages of the con:card+ philosophy which are: the GuideSpring for reliable positioning; an extra-smooth contact surface to protect the gold-plated printed-circuit board pads of the AdvancedMC modules (the AdvancedMC specification specifies 200 mating cycles for a module); a wear-resistant contact plating (palladium/nickel) for protection against rough board surfaces; a special relaxation resistant contact material; and ept's renowned rugged, gas-tight, corrosion-resistant low-resistance high-quality press-fit connection.

Measurements substantiate that with these designs the required transmission rates of up to12Gbit/s are easily attained.

The MicroTCA specification describes the power module, which is connected at the rear with the bus board by a new power connector.

After lengthy discussion in the PICMG consortium, it was decided to include two "footprints" in the specification for the power backplane connector.

This addressed the problem that one of the two footprints is protected by Tyco patent.

ept therefore played a major part in developing an additional footprint for inclusion in the specification.

It is not protected by patent and is therefore freely available.

This MicroTCA power connector is a combination of the familiar hm2.0-8 connector with 72 signal contacts and a UPM power component, which is now of two-row pattern with 24 power contacts.

This combination permits a load of up to 12A per pin.

ept supplies this power connector with the reliable ept Tcom press press-fit technology; as an open standard is used, other companies are able to enter the market as a second source of supply.

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