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News Release from: InterConnex
Edited by the Electronicstalk Editorial
Team on 19 February 2004
PCB technology forum looks at surface
finishes
InterConnex is hosting an opportunity to explore the latest developments in advanced PCB manufacturing and design technology.
InterConnex is hosting an opportunity to explore the latest developments in advanced PCB manufacturing and design technology Admission is free of charge
This article was originally published on Electronicstalk on 10 Jul 2008 at 8.00am (UK)
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InterConnex brings Fuba Printed Circuits to this forum as an established leader of European PCB technology.
Geared for designers and technologists, this event will cover hot topics such as: surface finish issues and alternatives; major trends in base material technology; overcoming constraints of high speed board design; mastering alternative solutions for heat dissipation; and reliability methodologies - CAF, CAT.
Surface finish issues today are driven by the quest for low cost, high reliability solutions that are also environmentally sustainable.
As the European PCB technology leader, Fuba Printed Circuits has addressed these environmental issues years before the USA, and brings a distinct advantage of successful experience to this topic.
"This event will undoubtedly unveil their position of technological leadership and bring a wealth of information to those looking for alternative solutions for high complexity PCBs", says Sonia Beaulieu, President of InterConnex.
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