New distributor for wire bondable chips

IRC Advanced Film Division has added Chip Supply as a die distributor for its wire bondable chips.

Giving design engineers of hybrid microelectronics expanded options and worldwide availability for ultra stable, tantalum nitride miniature resistor die, TT electronics IRC Advanced Film Division has added Chip Supply as a die distributor for its wire bondable chips.

Designated the WBC Series, the resistors feature IRC's self-passivating TaNSil tantalum nitride thin film technology on silicon substrates.

"This partnership enables us to provide our products to customers from organisations of all sizes throughout the world", said Steve Wade, Director of Sales and Marketing for IRC Advanced Film Division.

"As the largest die distributor in the world, Chip Supply has the specialised experience needed to provide superior technical service for our wire bondable resistor die products".

Located in Orlando, Florida, Chip Supply has a facility comprising two clean rooms and five buildings of processing space.

Chip Supply will distribute IRC's WBC Series product to all markets, including aerospace, military, medical, computer, networking, wireless, commercial and industrial.

The WBC resistors have exceptional TCR values down to +/-25ppm/C with a resistance range from 100ohm to 400kohm.

Backside contacts are available.

Absolute tolerance ranges are available down to +/-0.1%.

As with all IRC products, devices outside these specifications can be produced to meet specific customer requirements.

Pricing for the WBC Series resistors typically starts at $1.00 each in quantities of 1000 pieces.

Back to top