Product category:
Electronics Manufacturing Materials and Consumables
News Release from: IRC Advanced Film Division | Subject: TFC copper substrate
Edited by the Electronicstalk Editorial
Team on 30 August 2007
Copper substrate handles high-current
use
TT electronics IRC Advanced Film Division's cost-effective, solderable thick film copper substrate is now being specified for high-current and power module applications.
TT electronics IRC Advanced Film Division's solderable thick film copper substrate is now being specified for high-current and power module applications The TFC copper formulation uses a screen-printing process where the copper traces are printed on an alumina ceramic substrate and fired at temperatures up to 1000C
This article was originally published on Electronicstalk on 3 Oct 2005 at 8.00am (UK)
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According to Tom Morris, Applications Engineering Manager for IRC Advanced Film Division, the thick film copper substrates provide a number of advantages over direct bonded copper (DBC) substrates.
"Because the thick film copper substrates use an additive process as opposed to the etching process required by DBC substrates, the copper substrates are cost-effective, and high-current, current sense resistors can be integrated into the conductors on the substrate", said Morris.
"Additionally, the thick film copper formulation provides the substrates with high current carrying capability and excellent thermal management characteristics".
The TFC series copper substrates are ideal for a variety of power applications where a significant amount of current is required, such as thermo-electric coolers and power modules.
The TFC series substrates feature an adhesive copper strength of over 20N/mm2, thermal expansion of 7.3 parts per million/degree C and very low thermal impedance.
Conductor thickness ranges from 20 to 250 microns, with a minimum conductor width and space between conductors of 0.5mm.
When integrated onto the substrate, the resistors feature an ohmic range down to 0.001ohm, with tolerances to +/-1%, ideal for current sensing or high-power dissipation The substrates are available in thicknesses ranging from 0.25 to 1.0mm, and sizes up to 114.3 x 158.75mm.
They can be laser-scribed or green-scored.
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