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Exhibitions, Courses, Conferences and Training
News Release from: Intertech-Pira
Edited by the Electronicstalk Editorial
Team on 18 March 2008
Packaging conference focuses on LED
lighting
Event will appeal to all those involved in the manufacture, research, design and end use of high-brightness LEDs.
Intertech-Pira's third annual LED Packaging Conference is set for 15th to 17th April 2008 at the Golden Sands Beach Resort in Penang, Malaysia The conference will appeal to all those involved in the manufacture, research, design and end use of high-brightness LEDs, and aims to provide delegates with the essential technical insights and industry contacts to get to the top of this competitive industry
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The conference will focus on all aspects of packaging, and how efficiencies can be improved to accelerate the adoption of LEDs in lighting, automotive and display applications.
Speakers at this event will address the key topics in high-power LED packaging technologies and assess the prospects for LEDs in leading and new applications.
The morning of Tuesday 15th April is devoted to an optional preconference workshop that will provide a comprehensive overview of silicone encapsulants and thermal coupling compounds - two families of synthetic materials that improve the functionality and marketability of HB LED lamps.
Delegates will learn about the basic chemistry behind these materials, how each material is formulated, how custom formulations can match material characteristics to the specific needs of an HB LED packager, and the benefits each material adds to the finished HB LED product.
The workshop will also discuss the precautions for dispensing and handling these materials in a manufacturing environment.
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