Product category:
Plugs and Sockets
News Release from: ITT Interconnect Solutions | Subject: Cosmid 75i
Edited by the Electronicstalk Editorial
Team on 05 November 2003
Surface mounting boosts coax termination
density
A new range of surface-mount coaxial connectors are designed for switching and transmission equipment in telecomms applications.
A new range of surface-mount coaxial connectors are designed for switching and transmission equipment in telecomms applications Cosmid (coax surface mount mid) 75i connectors use moulded interconnect device technology - a process which allows the selective metallisation of 3D plastic shapes
This article was originally published on Electronicstalk on 1 Jul 2008 at 8.00am (UK)
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Two, three or four coaxial connector lines can be integrated into a single surface-mount module.
Designed with a flat top to facilitate pick and place, Cosmid connectors are available tape and reel packaged.
Explains Product Manager, Graham Oakley: "Industry has been demanding surface mount devices for some time, but traditional devices are not appropriate.
These modular devices are lightweight, and because they combine two, three or four lines in one package, we have been able to increase the surface area available for solder pads, ensuring reliable surface-mount electrical and mechanical connection".
Cosmid connectors feature the 1.0/2.3 coaxial interface to CECC22230 with a typical reflection factor of less than 0.1 up to 500MHz.
The modular design means that designers can incorporate more coax lines on a card edge than ever before.
Not only can both sides of the PCB card edge be used because the devices are surface mount in style, but for even higher densities, the four line modules are configured in stacked 2 x 2 formation, doubling the line density once more.
Continues Oakley: "Other alternative approaches use metal-bodied devices which can cause thermal mismatch between connector and PCB.
Cosmid connectors are a much closer thermal match to standard FR4, and can be processed through normal reflow soldering processes at temperatures up to 245C".
He concludes: "Cosmid should be viewed as a 3D circuit technology, which can accommodate a number of interconnection ports.
It is quite possible to add other components, such as decoupling capacitors and filters, and in the future, assembly processes could be simplified, by incorporating front panel elements into the design, resulting in a reduced total cost". Request a free brochure from ITT Interconnect Solutions ...
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