Click on the advert above to visit the company web site

Product category: EMC Components
News Release from: ITT Interconnect Solutions | Subject: CoF filter connectors
Edited by the Electronicstalk Editorial Team on 09 March 2006

Flex circuits offer new route to filter
connectors

New filtered connectors are ideal for high reliability military, aerospace and industrial applications.

ITT's new Cannon Chip on Flex (CoF) filter technology virtually eliminates all stress from thermal shock and vibration while providing superior protection to sensitive electronics in a new lighter weight package In the MIL-DTL-38999 configurations, the CoF connectors have passed MIL-STD and MIL-DTL Series III testing for thermal shock, random vibration, humidity and high altitude

The filter connectors are ideal for high reliability military, aerospace and industrial applications including integrated avionics, radio and navigation systems, fire control devices, electronic countermeasures, satellite communications and data transmitters.

The unique Cannon CoF design replaces the internal and traditional ceramic planar array block capacitor with a state of the art flexible circuit where individual chip capacitors are surface mounted on a pad adjacent to the feedthrough contact.

As the feedthrough contacts are not soldered directly the capacitor, thermal stress points that impact performance in thermal shock and vibration have been virtually eliminated.

The result is a very robust filter connector with superior mechanical performance and improved reliability.

In addition, because the flex is significantly lighter in weight, a connector weight reduction of up to 15% is achieved for the Mil-DTL-38999 configurations.

ITT's new Cannon CoF filter connectors provides all the standard filtering capabilities, such as individual isolated pin filtering of high-frequency noise, built-in ground plane barriers in the connector inserts, and filtering at the face of system boxes.

This Chip on Flex filter approach however offers the system designer complete flexibility in defining or changing individual circuit capacitance, ground and EMP performance during the design/development phase - eliminating any need to retool the ceramic planar array.

The Cannon CoF design uses readily available flex circuits and active components leading to reduced design/development cycle times, overall hardware delivery lead times and cost. Request a free brochure from ITT Interconnect Solutions ...

ITT Interconnect Solutions: contact details and other news
Email this article to a colleague
Register for the free Electronicstalk email newsletter
Electronicstalk Home Page

Search the Pro-Talk network of sites