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News Release from: ITT Interconnect Solutions | Subject: Chip on Flex (CoF) filter technology
Edited by the Electronicstalk Editorial Team on 13 March 2008

Filter protects sensitive electronics

Since the feed through contacts are not soldered directly to the capacitor, thermal stress points have been virtually eliminated.

TT Interconnect Solutions is ramping up its production capacity in response to market demands for its new Chip on Flex (CoF) filter technology, which virtually eliminates all stress from thermal shock and vibration while providing superior protection to sensitive electronics in a new lighter weight package In MIL-DTL-38999 configurations, the CoF connectors have passed MIL-DTL-38999 series III testing for thermal shock, random vibration, humidity and high altitude

The filter connectors are suitable for high-reliability military, aerospace and industrial applications, including integrated avionics, radio and navigation systems, fire control devices, electronic counter measures, satellite communications and data transmitters.

Cannon's CoF design replaces the internal and traditional ceramic planar array block capacitors with a flexible circuit where individual chip capacitors are surface mounted on a pad adjacent to the feed through contact.

Since the feed through contacts are not soldered directly to the capacitor, thermal stress points have been virtually eliminated.

The result is a very robust filter connector with superior mechanical performance and improved reliability.

In addition, because the flex is significantly lighter in weight, a connector weight reduction of up to 15% is achieved for the MIL-DTL-38999 configurations.

CoF filter connectors provide all the standard filtering capabilities, such as individual isolated pin filtering of high-frequency noise, built-in ground plane barriers in the connector inserts and filtering at the face of system boxes.

The approach offers the system designer flexibility in defining or changing individual circuit capacitance, ground and EMP performance during the design/development phase, eliminating any need to retool the ceramic planar array. Request a free brochure from ITT Interconnect Solutions ...

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