ITT introduces the nano NDD connectors
An
ITT Interconnect Solutions product story
Edited by the Electronicstalk editorial team
Nov 18, 2008
ITT Interconnect Solutions has released a range of 0.635mm pitch connectors suitable for harsh environments and military applications.
The nano NDD series are low-profile high-density dual row miniature connectors for applications where size and weight is limited, such as avionics, aerospace, defence electronics, industrial control systems and medical diagnostic equipment.
The NDD nano miniature series is based on 0.635mm pitch contact spacing, which allows a very high signal density in an absolute minimum of space.
The connectors pass the requirements set by the MIL-DTL-32139 military specification.
The NDD nano miniature series is based on 0.635mm pitch contact spacing, which allows a high signal density in minimum space.
The connectors use ITT's micro twist pin technology, with five points of electrical contact and high-reliability crimp joints, to ensure signal integrity and provide reliable performance in adverse conditions, with operating temperatures between -55 and +125C.
A temperature rating of +200C is available with special termination processes.
The NDD nano connectors can cope with vibration up to 20G and shock up to 100G and have 48 hour salt spray/corrosion resistance.
High temperature LCP dielectric material provides insulation capable of withstanding voltage of 250V AC RMS at sea level and 100V AC RMS at 70,000 feet.
Electrical specifications include a contact rating of 1A and a maximum contact resistance rating of 71mV drop.
The connectors can be mounted directly onto the PCB with a through-hole mating plug connector; a surface mount version will be available shortly.
Cable harnesses are available for the NDD nano miniature series in discrete insulated wires, ribbon cable and flex circuit terminations.
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Contact ITT Interconnect Solutions
Tel +1 617 926 6400
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