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News Release from: Institution of Engineering and Technology
Edited by the Electronicstalk Editorial
Team on 28 April 2006
Big guns to present at semiconductor
forum
The FSA and the Institution of Engineering and Technology have published the programme for the IET/FSA International Semiconductor Executive Forum.
The FSA and the Institution of Engineering and Technology have published the programme for the IET/FSA International Semiconductor Executive Forum The event will be held on 9th and 10th May 2006 at the Hotel Bayerischer Hof in Munich, Germany
This article was originally published on Electronicstalk on 30 Mar 2005 at 8.00am (UK)
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Semiconductor Executive Forum to be held in UK
The second IEE/FSA International Semiconductor Executive Forum brings together executives from the entire semiconductor industry, including fabless, foundry, test and packaging companies.
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Leading UK engineering and technology firms, with a combined multi-million pound spend on training and development, will assemble at the IEE 'Investing in Technical Teams' forum on 4 November 2004.
The first day's programme will focus on the global communications and consumer electronics markets.
The second day will concentrate on an overview of the semiconductor market, supply chain and venture capital funding.
To kick-off the event, keynote speaker Scott McGregor, President, Chief Executive Officer, and Member of the Board of Directors for Broadcom Corporation, will present "The fabless CMOS future".
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"I am pleased to join high tech industry leaders and executives from around the globe to examine the most pressing issues impacting today's semiconductor industry", said McGregor.
"As one of the world's largest fabless semiconductor companies, Broadcom offers a unique perspective on the levels of integration, cost and power reduction that are driving communications convergence".
"I look forward to presenting my thoughts on both the historical and future technology and business trends uniquely enabled by the fabless model".
Also addressing the communications topic is Loic Lietar, Group Vice President, Strategies at STMicroelectronics, in his keynote speech entitled: "The journey of convergence and its consequences on the semiconductor industry".
"While convergence has been happening at the boundary of electronic appliances with increasingly shared connectivity and multimedia standards, it hasn't yet made a dent at the heart of these systems, and as such hasn't really affected the positions in the industry", said Lietar.
"I am pleased to have the opportunity in Munich to examine the next triggers and their consequences for the industry and to present ST's vision on leveraging these trends".
Additional content surrounding the topic of communications will include presentations on the future mobile world, total communication opportunities and solutions for rapidly changing markets.
Consumer electronics will be examined through presentations on topics, which include the role of audio in digital consumer goods and developing innovative products.
This will be followed by a panel session to discuss future consumer market opportunities.
The programme for day one will conclude with a keynote speech, entitled: "IDMs: how can they have the best of both worlds; strong in-house technology competences and lean cost structures like fabless companies?", presented by Dr Erk Thorsten Heyen, Corporate Vice President, Strategy, Mergers and Acquisitions at Infineon Technologies.
"Following Moore's law, process technology development is becoming more and more complex and costly".
"As a consequence, even large IDMs are embarking on 'fab light' strategies".
"At the same time fabless companies need to invest more into process technology and library expertise", said Heyen.
"In light of this fascinating development, I am pleased to have the opportunity to deliver a speech at the IET/FSA International Semiconductor Executive Forum".
That evening, Sir Robin Saxby, Chairman of ARM Holdings, will host a VIP dinner for delegates of the forum.
The programme on day two will begin with Hermann Hauser, cofounder of Amadeus Capital Partners, who will deliver the morning keynote entitled: "Plastic electronics - the next big thing?".
Presentations further exploring the overall semiconductor market will focus on the future of the semiconductor industry and the expanding role of the semiconductor foundry.
In addition, a case study about regional development in Saxony and its success factors will be presented.
Dr Tien Wu, Chief Operating Officer, ASE Group, will deliver the keynote address on the global semiconductor supply chain, focusing on "Symbiosis in the consumer world".
"I am honoured by the invitation to speak at the Forum in Munich", said Dr Wu.
"My presentation will centre on the dynamics of the consumer market as a key driving force of the semiconductor industry".
"It is precisely these dynamic factors that link players into a network of interdependency".
"We need to further understand the environment that leads us to excel in supporting the ever-changing demands of a consumer market, and I believe that my presentation will clearly illustrate this".
Elaborating on the supply chain theme will be a case study about semiconductor yield improvement and how good front end design reduces manufacturing costs.
This will be followed by a panel discussion to consider the trends, threats and opportunities involved with the semiconductor manufacturing process.
A panel discussion on venture capital funding will conclude the forum.
Alongside the forum, the FSA Suppliers Expo Europe will provide semiconductor professionals an opportunity to view the latest products and services from global suppliers.
Admission to the expo is free-of-charge.
Platinum sponsors for this event include ARM, Austriamicrosystems, TSMC and X-Fab. Request free introductory details about products from Institution of Engineering and Technology ...
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