Product category:
Wireless Communications
News Release from: Jacket Micro Devices | Subject: M20006 and M20007
Edited by the Electronicstalk Editorial
Team on 11 January 2007
RF modules enable 802.11n reference
design
Qualcomm has selected Jacket Micro Devices' M20006 and M20007 RF modules for its draft 2.0 compliant 802.11n AGN400 chipset reference design.
Qualcomm has selected Jacket Micro Devices' M20006 and M20007 RF modules for its draft 2.0 compliant 802.11n AGN400 chipset reference design The combination of Qualcomm's advanced chipset and JMD's FEM technology enable Qualcomm to implement a 2x3 dual band MIMO architecture with the RF portion occupying only 98mm2 of board space
This article was originally published on Electronicstalk on 14 Dec 2006 at 8.00am (UK)
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JMD's level of integration within the module reduces the bill of materials (BOM) for Qualcomm and allows for reliable manufacturing and small form factor reference designs.
The performance of the JMD RF modules, when coupled with Qualcomm's AGN400 chipset, achieves throughput speeds of 315Mbit/s.
The AGN400 is the world's first chipset offering full support for Draft 2.0 of the IEEE802.11n standard.
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The AGN400 chipset is the fourth generation 802.11n-compliant chipset from Qualcomm and features Qualcomm's True MIMO Gen-N technology.
True MIMO Gen-N capitalises on Qualcomm's patented innovations in multiple antenna technology to extend the effective range and bolster data throughput for consumer Wi-Fi and next-generation wireless digital home entertainment devices.
"We believe JMD's unique multilayer organic (MLO) technology is the only choice for multiband, high performance and space constrained RF circuits like the Qualcomm AGN400", said Jim Stratigos, President and CEO of Jacket Micro Devices.
"The complexity of OFDM and MIMO architectures requires a high degree of integration to provide functionality in the smallest space possible".
"JMD has the only technology which enables multiple radio designs for space-constrained devices".
The AGN400 chipset, reference designs and software are currently sampling with lead customers and are being publicly demonstrated at the 2007 International Consumer Electronics Show in Las Vegas.
Products containing True MIMO Gen-N technology are expected to be commercially available in the first quarter of 2007.
The M20006 and M20007 comprise a complete dual band 2x3 RF front end module (FEM) for 802.11a/b/g/n applications.
The 1x1 MIMO building block M20006 can stand alone or be used in combination with the M20007 1x2 MIMO FEM to implement all popular MIMO structures including 2x2, 2x3 and 3x3.
The 7 x 7 x 1.4mm LGA package contains dual band transmit and receive chains ideal for small form factors such as notebook PCI Express mini cards, USB dongles, and embedded WLAN interfaces.
The single package includes all RF filters, baluns, PAs, LNAs, and switches to reduce size and minimise assembly costs of the deployment of new WLAN standards.
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