Multilayer organic technology in showcase

Edited by the Electronicstalk editorial team May 10, 2007

Patented multilayer organic (MLO) technology from Jacket Micro Devices has been selected for the SEMI Technology Innovation Showcase award.

Patented multilayer organic (MLO) technology from Jacket Micro Devices has been selected for the SEMI Technology Innovation Showcase award.

SEMI's Technology Innovation Showcase is designed to highlight innovative technologies with new applications to current challenges in semiconductor manufacturing test and assembly.

JMD's packaging technology enables manufacturers to overcome the barriers to cost and sise reductions in RFIC designs, helping the semiconductor industry meet the challenge for smaller, less expensive and less complex designs.

As a participant in the Test, Assembly and Packaging category, JMD will be featured at the 6th annual Technology Innovation Showcase, which is held in conjunction with Semicon West 2007, North America's largest microelectronics gathering of industry decision-makers.

The three-day event will be held from 17th to 19th July 2007 at the Moscone centre in San Francisco, California.

"The Technology Innovation Showcase awards acknowledge the tremendous contributions made by innovative design and manufacturing providers in many diverse areas, each advancing technology", said Eelco Bergman, TIS Test, Assembly and Packaging Awards Chair.

"Winners are selected because we believe their innovations represent potential for significant impact on the semiconductor industry".

A panel of industry experts reviewed over 100 applications and selected the winners based on technical merit, relevance, and significance to the semiconductor market.

"Each year it becomes increasingly more challenging for companies to provide RF components that can meet the needs for progressively smaller, higher performance and more functional wireless products", said JMD CEO Jim Stratigos.

"JMD is committed to using MLO packaging to move the bar forward for new generations of complex wireless products that need highly integrated RF solutions".