Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Jacket Micro Devices
Edited by the Electronicstalk Editorial
Team on 23 August 2007
3D interconnect structure recognised
with patent
Patent covers new methods for making 3D liquid crystal polymer (LCP) interconnect structures using a high-temperature single-sided LCP and a low-temperature single-sided LCP.
Jacket Micro Devices has received patent approval for new methods of fabricating three-dimensional all-organic interconnect structures These new methods are an extension of JMD's multilayer organic (MLO) packaging technologies
This article was originally published on Electronicstalk on 14 Dec 2006 at 8.00am (UK)
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The patent, entitled "Methods for fabricating three-dimensional all-organic interconnect structures", is JMD's fifth patent related to MLO design and technology.
The patent covers new methods for making 3D liquid crystal polymer (LCP) interconnect structures using a high-temperature, single-sided LCP and a low-temperature, single-sided LCP, where both are drilled, using a laser or mechanical process, to add a z-axis connection.
The addition of z-axis interconnectivity in a homogenous organic material allows for the easy design and implementation of complex 3D multilayer circuit patterns.
"Developers of front end modules for wireless applications have relied on the same material technologies and processes for more than 25 years", says George White, PhD, Chief Technology Officer, Jacket Micro Devices.
"Emerging market demands for applications using MIMO such as WiMAX and 11n WLAN enabled devices are creating a need for new solutions that are both smaller and more functional".
"JMD's newly patented process enables a dramatic increase in passive component density by enabling z-axis interconnects in homogenous organic materials".
White further explains: "This patent also allows for any layer via interconnects which makes it the highest component density MLO technology in the world".
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