Product category:
PCB Assembly Equipment and Tools
News Release from: JBC Industrias | Subject: Advanced system
Edited by the Electronicstalk Editorial
Team on 17 October 2002
MPU-controlled system provides gentler
soldering
JBC has developed a microprocessor-driven heating system that provides very fast heat recovery so that soldering systems can operate at lower temperatures than previously possible.
JBC has developed a microprocessor-driven heating system that provides very fast heat recovery so that soldering systems can operate at lower temperatures than previously possible Not only does this provide faster soldering but also the system is kinder to circuit boards and components and also extends tip life thus significantly reducing operating costs
This article was originally published on Electronicstalk on 21 Aug 2002 at 8.00am (UK)
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The JBC Advanced system is said to give an 80% improvement over the performance of conventional soldering tools.
For instance while a conventional station can take between 10 and 90s to reach 350C any Advanced station with the company's 2210 handpiece can reach this temperature in only 2s.
The heating system used achieves a high heating power in a very small cartridge, which means that the mass to be heated is small and therefore the thermal inertia is minimal.
In tests measuring the time taken to perform a series of five solder joints the Advance station completed the task in only 8s with a temperature drop of just 30C - a conventional system took twice this time- 16s - and suffered a temperature drop of 70C.
Tip life can be up to five times longer than usual because as soon as the soldering iron is left on its stand the tip temperature automatically drops to 250C, reducing the wear on the tip.
When the soldering iron is taken out of the stand the soldering temperature is rapidly recovered because of the cartridge's small mass.
Fast recovery also means that soldering can takes place at much lower temperatures with a maximum of 370C, instead of the more common 450C, eliminating the risk of damage to components as there is no excessive heat.
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