Categories
- Active Components (11,826)
- Passive Components (2,927)
- Design and Development (9,365)
- Enclosures and Panel Products (3,227)
- Interconnection (2,817)
- Electronics Manufacturing, Production and Packaging (3,046)
- Industry News (1,895)
- Optoelectronics (1,600)
- Power Supplies (2,276)
- Subassemblies (4,520)
- Test and Measurement (4,920)
Form-in-place gasket material is silicone free
A
Jenton International product story
Edited by the Electronicstalk editorial team
Jan 18, 2002
New from Jenton International is a family of one-component fast-curing electronic grade formulations, the EMCAST FIPG 1850 series from Electronic Materials Incorporated.
New from Jenton International is a family of one-component fast-curing electronic grade formulations, the EMCAST FIPG 1850 series from Electronic Materials Incorporated.
These room-temperature-stable, UV- and/or heat-activated prepolymers are designed as an adhesive/sealant and/or gasket with the added advantage of being an effective vibration damper.
They can be cured almost instantly to a soft polymer by exposing to UV light in the 325-380nm range.
Various hardnesses and viscosities are available to suit the various substrates and end-use conditions in microelectronics.
Not what you're looking for? Search the site.
Contact Jenton International
Related Stories
