Product category:
PCB Assembly Equipment and Tools
News Release from: Kaisertech | Subject: MicroJoin model 2100 pulsed heat hot bar bonder
Edited by the Electronicstalk Editorial
Team on 05 September 2001
Hot bar bonder tackles many tasks
Kaisertech has introduced the low-cost MicroJoin model 2100 pulsed heat hot bar bonder that integrates the critical features and functions needed for soldering, heat seal or ACF bonding
Kaisertech has introduced the low-cost MicroJoin model 2100 pulsed heat hot bar bonder that integrates the critical features and functions needed for soldering, heat seal or ACF (anisotropic conductive film) bonding Users can also cost-effectively tailor the unit to almost any specific bonding application such as ribbon cables, flex connectors, TAB-to-board and heat seal connectors
This article was originally published on Electronicstalk on 18 Oct 2000 at 8.00am (UK)
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Flux, bond and test small LCDs with one unit
MicroJoin's new Model 5200 PDI Bonder efficiently integrates the fluxing, bonding and testing processes for small LCD displays within a single, cost-effective assembly system
The system combines a temperature controller, ceramic hot bars, precision part positioning/alignment mechanisms, high accuracy z-axis hot bar actuator and a microprocessor-controlled user interface.
The temperature controller provides power for rapid heating, combined with precise closed-loop control to minimise overshoot and to maintain fast, sustained cycle times.
The system can store bonding profiles in nonvolatile RAM, and there are built-in quick-change capabilities for attaching different sizes of hot bars.
Options include different x-y and rotary positioning stages, visual alignment aids, and auto flux dispensing, enabling the user to tailor the system at low cost. Request a free brochure from Kaisertech ...
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