Product category:
PCB Assembly Equipment and Tools
News Release from: Kaisertech | Subject: APE Marksman BGA rework system
Edited by the Electronicstalk Editorial
Team on 19 February 2004
BGA rework system provides efficient
heat
The APE Marksman BGA rework system features a 1200W reflow head plus a 1200W under board heater for optimum efficiency.
The APE Marksman BGA rework system features a 1200W reflow head plus a 1200W under board heater for optimum efficiency In addition the reflow head has 64mm of z-axis travel to accommodate virtually any component height
A computer interface is standard for unlimited thermal profile storage and additionally four integrated real-time thermocouples are included for profile development.
A 17in flat panel PC is incorporated and there is Windows based software as standard.
Placement vision is provided by a digital, automated system for the 325 x 375mm work area and once the IC has been desoldered it can be removed by the unit's vacuum device, The system is supplied with five nozzles that can be selected from a range of over 200.
Options include PCB frame style holders, thermocouple extension links and an infra-red thermocouple. Request a free brochure from Kaisertech ...
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