Modular system handles all placement requirements

The Assembleon A-Series component placer is capable of mounting 30,000 to 100,000 components per hour in high-mix SMT applications.

The Assembleon A-Series component placer is capable of mounting 30,000 to 100,000 components per hour in high-mix SMT applications.

Modular construction is the key concept of the A-Series that brings together proven technologies to handle all placement requirements, from 0101 through ICs and advanced packages to odd forms.

Line reconfigurations can be carried out in just a few minutes and platform reconfigurations can be achieved without the need for recalibration.

The modular concept places value not in the base frame but in the individual placement modules, which means that manufacturers only face investments when they actually need capacity.

Application flexibility is achieved by combining proven chipshooter and fine-pitch placement capabilities.

Dedicated technologies are employed where required, for example fast parallel placement technology for the many chip components and ICs, and high-accuracy vision alignment and H-drive linear motors for advanced packages and odd forms.

Accuracy classes are 75, 50 and 25um at four sigma, and the appropriate accuracy class for each component is automatically selectable.

Three versions are available, the AX-3, the AX-5 and the AQ-1.

The AX-3 and the AX-5 are, respectively, three- and five-segment frames providing a PCB transport system and prepared for the addition of placement robots.

Each frame supports a number of plug-and-play interfaces to pick-and-place robots that offer capacity expansion in 5000-component-per-hour increments.

Minimum configuration is a three-segment base employing six standard pick-and-place robots delivering 30,000 components per hour throughput.

Each base can be equipped with two types of placement robots featuring second-generation laser alignment for placing chips and smaller ICs.

Finally the modular AQ-1 frame, integrated with the AX-type platform and featuring linear motor H-drive technology to place any additional complex parts, completes the A-series.

This frame can be configured for any application to place advanced ICs, microBGAs, CSPs and even flip chips and odd forms.

Programmable servo control on the z-axis ensures that all components are placed with the appropriate z-force.

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