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Soldering systems suit high-power LEDs

A Kaisertech product story
Edited by the Electronicstalk editorial team Jun 3, 2004

A soldering system for processing the new generation of high-power LEDs for lighting applications is now available from Kaisertech.

A soldering system for processing the new generation of high-power LEDs for lighting applications is now available from Kaisertech.

The Unitek Eapro equipment has been developed to solder these LEDs on metal composite printed circuit boards (MCPCB), needed to dissipate heat away from the LEDs during soldering.

Maximum temperature of these LEDs cannot exceed 106C, which means that reflow ovens are not suitable.

The Unitek Eapro solution uses a selective soldering system that generates high energy density in a short time span.

Three systems are available, all effectively producing solder joints on aluminium substrate at much lower costs than previously possible.

The desktop system is mainly for laboratory and prototyping use where process stability and repeatability are both important but speed is less of a consideration.

Two solutions are offered for volume applications.

The first is a tabletop, programmable x, y, z robot.

Soldering is automatic but the aluminium substrates are manually loaded into the machine.

The second is a high-end system with automatic alignment, x, y, z movement and solder head rotation.

It can also be integrated in pick and place production lines.

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