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Product category: PCB Assembly Equipment and Tools
News Release from: Kaisertech | Subject: Dima convection reflow ovens
Edited by the Electronicstalk Editorial Team on 18 August 2004

Convection reflow ovens are ready for
lead-free

The Dima range of convection reflow ovens features lead-free capability to meet future electronics industry needs in view of the forthcoming lead ban.

The Dima range of convection reflow ovens features lead-free capability to meet future electronics industry needs in view of the forthcoming lead ban The RO-403 convection reflow oven can take printed circuit boards up to 400mm wide and the stainless steel mesh conveyor belt's speed is adjustable from 50 to 800mm/min through its 960mm tunnel

It is available as a benchtop unit or can be converted to floor standing by adding a cabinet stand.

The oven has topside circulating forced hot air and preheat temperatures are maintained long enough to permit activation of fluxes but exposure of the components to higher reflow temperatures is kept to a minimum.

Consistent edge-to-edge temperatures are maintained regardless of component size or density.

Variable profiling is achieved by eight independently controlled heating zones, with bottom side heating also adjustable to prevent overheating of inverted components on double-sided boards.

These eight independent settings enable the user to achieve a very accurate profile on the small bandwidth of the lead-free profiles.

An LCD monitors the production run, with real time profiling shown in graph format and board temperatures through each zone shown in real time.

An ioniser is fitted as standard in the cool down zone to eliminate the possibility of damage caused by static.

Other standard features include microprocessor control with RS232 interface and speed and temperature profiling controlled via the LCD display or, optionally, by PC.

The free-standing RO-406 also accepts PCBs up to 400mm but has a 1.6m long tunnel for high-end use.

Its process chambers allow exact control of each cell and provide a uniform airflow across the board.

The construction of the heating cell ensures stability under varying loads and the rapid response heaters give uniform heating for consistent results.

Flat heater panels provide basic heat to the underside of the board.

A microprocessor controller separately controls top and bottom heating zones with graphic display allowing temperature profiles to be plotted on screen.

Windows based PC software is optional.

Separate top and bottom fans cool the PCB and an Ioniser unit protects the PCB from static.

The process chamber is divided both at the top and bottom into one preheating zone, two soak zones and one reflow zone.

The upper chamber is heated by circulating hot air while a flat heater panel heats the lower chamber.

Temperature differences between two cells can be varied by up to 100C.

The Solano model, designed from the outset for lead-free, provides 500mm PCB width capability through a 2m long tunnel.

Similar in specification to the smaller RO-406, the temperature differences between its top and bottom sections can be varied by up to 140C, and a filtration system removes flux from the exhaust air to keep the oven clean on the inside.

Windows based software is optional for linking the unit to a PC so that the operator can analyse process information and produce printed documentation for quality assurance. Request a free brochure from Kaisertech ...

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