Unit prepares SMDs for placement

Edited by the Electronicstalk editorial team May 9, 2005

The Dima Handytaper from Kaisertech provides a quick and reliable method of packaging low to medium volumes of SMD components ready for automatic placement.

The Dima Handytaper from Kaisertech provides a quick and reliable method of packaging low to medium volumes of SMD components ready for automatic placement.

It can tape up to 600-800 components per hour, and a programmable microprocessor controlled system gives the operator the ability to set the size of the cavity, number of component to be taped and speed of transport.

A "cold seal" method of sealing the cover tape does not require heat or additional adhesives.

The unit is available with or without a pick-and-place head.

For taping QFP or other large components a model with an integrated pick and place arm is available.