Product category:
Gaskets, Seals and Screens
News Release from: KEC | Subject: EMC backshells for micro D connectors
Edited by the Electronicstalk Editorial
Team on 15 May 2002
EMC backshells for micro D connectors
KEC has developed a new range of EMC backshells for micro D connectors that caters for modern system requirements.
KEC has developed a new range of EMC backshells for micro D connectors that caters for modern system requirements The micro D connector is widely used in many commercial and military applications where the space available for connectors, backshells and cabling is extremely restricted
This article was originally published on Electronicstalk on 30 Mar 2000 at 8.00am (UK)
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Tempest high performance level EMC backshell
The KC 2300 is a series of high performance EMC backshells that provides excellent protection including Tempest levels but is reduced in sizeand weight from other backshells in the range.
However, this type of application often requires sealing, screening and strain relief and these techniques make big demands on the very space that is so precious.
KEC's standard range of MMD backshells has been solving these problems for many years but recently applications have become more taxing due to increased system sophistication.
Whereas previously, simple, circular cable entries were the norm, modern systems demand solutions encompassing many different types of cable solution.
Drawing from years of experience in developing cost effective solutions for missile, aerospace and commercial applications, the new range of KEC backshells employs special solutions and designs to cater for these modern systems.
Variants can handle individual and overall screened circular cables, flexible flat PCBs with ground planes and applications where backshells are specially mounted onto an existing piece of equipment.
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