Product category:
Electronics Manufacturing Quality Assurance
News Release from: Kester
Edited by the Electronicstalk Editorial
Team on 06 September 2006
How to prevent lead-free defects
Kester Senior Market Development Engineer Peter Biocca will describe lead-free defects and how to avoid them at IPCWorks 2006.
Kester Senior Market Development Engineer Peter Biocca will present at IPCWorks 2006, scheduled to take place 10th to 14th September 2006, at the American Airlines Training and Conference centre in Fort Worth, Texas Biocca will present on the topic of "Lead-free defects - how to prevent them and real case studies"
This article was originally published on Electronicstalk on 28 Mar 2008 at 8.00am (UK)
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The presentation is a summary of the practical experiences from key assemblers in North America and Asia, and what measures are being taken to reduce and prevent specific types of defects in lead-free processes such as reflow, wave and hand-soldering.
It also shows what they are doing to maintain reliability and production yields similar to a leaded process.
Additionally, the presentation will address the main defects that can be encountered with lead-free soldering and will offer insight on proven methods to avoid them.
It will discuss the process variables in each process and how to optimise them to eliminate defects and maintain production yields comparable to leaded 63/37 processes.
Biocca's presentation is based on experiences obtained through many years of assisting assemblers in the transition to lead-free and, therefore, offers practical information on how to preserve joint reliability with lead-free soldering processes.
Offering a conference, courses and standards development meetings, IPC Works 2006 is for everyone involved in the printed circuit board and electronics assembly industry, from PCB and EMS companies to suppliers and OEMs.
The latest information is available on lead-free reliability, materials declaration and RoHS compliance.
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