Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Kester | Subject: EnviroMark 828
Edited by the Electronicstalk Editorial
Team on 28 March 2008
Water-soluble paste cleans up lead-free
soldering
Solder paste is billed as a breakthrough in water-soluble technology with the combination of low voiding, excellent wetting behaviour and ease of cleaning.
Kester's EnviroMark 828 lead free water-soluble solder paste is billed as a breakthrough in water-soluble technology with the combination of low voiding, excellent wetting behaviour and ease of cleaning Backed by the company's 100 years plus experience in soldering technology, Kester reckons EnviroMark 828 is the only lead free water-soluble solder paste that satisfies all assembly needs
The paste promises best in class BGA voiding performance together with best in class solderability, joint appearance and shininess.
It produces consistent solder paste volume deposits regardless of idle time, stencil life and print speed, and post-soldering residues are easily removed in a standard DI aqueous cleaning process.
EnviroMark 828 also promises excellent print definition and bridging prevention thanks to its nonslumping chemistry.
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