Product category:
Electronics Manufacturing Quality Assurance
News Release from: KIC Thermal Profiling | Subject: SlimKIC 2000
Edited by the Electronicstalk Editorial
Team on 08 July 2002
Software sets up soldering thermal
profiles
KIC has developed an exclusive software package that adds wave solder and curing capabilities to its SlimKIC 2000 thermal process development tool.
KIC has developed an exclusive software package that adds wave solder and curing capabilities to its SlimKIC 2000 thermal process development tool The new software allows users to set up their wave solder machines and curing ovens quickly using the industry standard SlimKIC 2000
This article was originally published on Electronicstalk on 4 Sep 2006 at 8.00am (UK)
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The new capabilities are built directly into the SlimKIC 2000 at no additional cost, and will soon be available to current users as a free download from KIC's website.
There is no need to purchase expensive and cumbersome hardware modules.
The software delivers separate statistics for pre-heat and wave, including dwell time, parallelism and solder pot temperature.
The SlimKIC 2000 integrates advanced new hardware and powerful software to make oven profiling faster, easier and more precise.
Features include a complete solder paste database, wireless download to ensure there are no "lost" profiles, the process window index (PWI), and a simplified user interface.
The addition of wave solder and curing functionality allows electronics assemblers to optimise all their thermal processes quickly and precisely, for increased manufacturing efficiency.
The system offers improved uptime by providing instant identification of whether or not the process is in specification.
It automatically identifies the optimal setup after checking all the alternatives in less than 60s.
It also provides improved yield and quality by ensuring that the production process runs in the centre of the process window, thus ensuring that the process can accommodate much larger drifts before an out-of-specification situation can occur.
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