SBCs to upgrade to next-generation Core Duo

Kontron will support the Intel Core 2 Duo processor T7400 in Q1 2007 on its existing platforms that already support the Intel Core Duo processor multicore technology.

Kontron will support the Intel Core 2 Duo processor T7400 in Q1 2007 on its existing platforms that already support the Intel Core Duo processor multicore technology.

These Kontron platforms cover a number of form factors such as 3U CompactPCI, 6U CompactPCI, ETXexpress/COM Express, ETX 3.0, ATX, Flex-ATX and Mini-ITX.

Other new Kontron platforms that are planned for introduction in Q1 2007 such as AdvancedMC will also support the new Intel processor.

The Intel Core2 Duo processor T7400 is one of the latest members of Intel's product line of multicore processors based on the new Intel Core micro-architecture.

This new microarchitecture is designed to deliver increased performance and better performance-per-watt thus increasing overall energy efficiency.

Customers will also be taking advantage of system -enhancing technologies in these new processor/chipset platforms such as Intel Virtualisation Technology and Intel Advanced Management Technology (Intel AMT).

Users that are already using or plan to use the existing platforms from Kontron based on the Intel Core Duo processor T2400/T2500 will have a seamless performance boost in 2007 by moving to the Intel Core2 Duo processor T7400 offering 4Mbyte of L2 cache compared with the standard 2Mbyte today as well as a 64bit architecture.

"We are excited by Intel's continuous enhancements to the performance-per -watt ratio and extended lifecycle support provided by the Intel Core2 Duo processor T7400".

"Customers in the embedded and communications market segments demand extended life cycles of 5-7 years as well as a competi tive roadmap with improvements in performance at a manageable thermal envelope", said Hannes Niederhauser, CEO of Kontron.

"The Intel Core2 Duo processor T7400, with a thermal design power of 34W, is ideal for communications and embedded designs requiring a low thermal envelope", said Doug Davis, Vice President and General Manger, Intel Communications Infrastructure Group.

"Kontron's choice of the T7400 for future designs in a variety of form factors shows the versatility and flexibility of our latest energy-efficient processors".

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