COM standard defines nano-scale modules

Kontron has defined another new footprint variant for computers-on-modules - nanoETXexpress.

Three years after the 2004 launch of the ETXexpress specification, which has become the PICMG COM Express (COM.0) standard, Kontron has defined another new footprint variant for computers-on-modules (COMs) - nanoETXexpress.

The nanoETXexpress specification is targeted to deliver extremely power-saving COMs with mid- to high-performance x86 technology on a footprint that is a mere 55 x 84mm.

This is 39% of the original COM Express module basic form factor of 125 x 95mm footprint and 51% the sise of of microETXexpress (95 x 95mm).

The new COM form factor follows the PICMG COM Express standard and will be 100% compliant with the COM.0 Type 1 connector.

The locations of the identically mapped pinouts will also be 100% COM.0 compliant.

The goal of nanoETXexpress specification is to build PCIe-based COMs on the smallest possible form factor.

Many new applications that will benefit from the nano-sise include handheld units for medical, mobile data solutions and other emerging applications that have not been possible as of yet due to sise restrictions.

"The nanoETXexpress specification will provide the ideal footprint for future applications, bearing in mind that forthcoming processor and system-on-chip (SoC) technology will be delivered in 45nm technology and beyond", says Dirk Finstel, CTO Embedded Modules Division, Kontron.

The specification, documentation for nanoETXexpress will be available under a nondisclosure agreement in Q4 2007.

Kontron plans to launch its first nanoETXexpress based COM in Q2 2008.

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