Product category:
Communications ICs (Wireless)
News Release from: KSW Microtec | Subject: Contactless credit card inlays
Edited by the Electronicstalk Editorial
Team on 25 February 2008
Credit card inlays come in sheet format
New sheet inlays can be directly laminated into PVC layers for fast, reliable and cost-effective contactless card production.
KSW Microtec now offers contactless credit card inlays in sheet format to expand manufacturing options for card makers The new inlays provide the same quality and performance as KSW's inlays for reel-to-sheet manufacturing, already proven by more than 20 million contactless credit cards in the US market alone
This article was originally published on Electronicstalk on 24 Dec 2007 at 8.00am (UK)
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Built on TSMC's 65nm low-power process, the Cyclone III family includes devices that are qualified for commercial, industrial and extended temperatures.
Thanks to KSW's special PET substrate, the new sheet inlays can be directly laminated into PVC layers for fast, reliable and cost-effective card production.
The ICs on the RFID inlays are attached using KSW's palladium bump technology, which generates an extremely reliable connection between chip and the aluminium antenna for a long inlay life span.
KSW's new inlays are available in several sheet formats and with a range of different microcontrollers.
KSW also offers the inlays with customised antennas and sheet form factors.
The advantages offered by the new sheet inlays to contactless credit card manufacturers are also available to UHF card suppliers.
KSW provides UHF RFID inlays in sheet format for conversion into UHF PVC cards.
Applications include border crossing and other long read range access control solutions.
KSW inlays are shipped using specially designed packaging for safe transport and maximum product integrity and reliability.
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