Kulicke and Soffa Industries web site, latest news and contact details

Address:
2101 Blair Mill Road
Willow Grove
PA 19090
USA
Telephone: (USA) +1 215-784-6000

Listing of all 27 news releases from Kulicke and Soffa Industries:

Wire bonders move to next generation

Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.

News from Kulicke and Soffa Industries (18 March 2008)

Bonding wire for ICs

MaxSoft bonding wire has fine speed and cost-effectiveness ratings.

News from Kulicke and Soffa Industries (30 April 2007)

Die bonders improve productivity

KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company.

News from Kulicke and Soffa Industries (25 April 2007)

Capillary ensures greater second bond quality

Kulicke and Soffa Industries has developed the Cupraplus that supports highly consistent and stable fine wire second bonds, while maintaining the quality of the overall wire bonding process.

News from Kulicke and Soffa Industries (14 December 2006)

Boulanger takes charge of die bonder operations

Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland.

News from Kulicke and Soffa Industries (20 November 2006)

Kulicke and Soffa to acquire Alphasem

Kulicke and Soffa Industries has signed an agreement to acquire Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International.

News from Kulicke and Soffa Industries (13 October 2006)

Wire bonder is named as best product

Kulicke and Soffa Industries has received the prestigious Editors' Choice Best Product Award, presented annually by Semiconductor International magazine, for its Maxum Ultra wire bonder.

News from Kulicke and Soffa Industries (11 July 2006)

K and S to divest test operations

Kulicke and Soffa Industries is planning to tighten its focus on semiconductor assembly equipment and materials and create value for its shareholders.

News from Kulicke and Soffa Industries ( 6 February 2006)

Chinese plant expands into blades and sockets

Kulicke and Soffa Industries has expanded its facility in Suzhou, China to become fully operational in its manufacturing capabilities to produce both dicing hub blades and test sockets.

News from Kulicke and Soffa Industries (16 September 2005)

Package test technology wins award

Kulicke and Soffa Industries has won a 2005 Advanced Packaging Award in the Semiconductor Assembly and Test Services category for its new Quatrix photolithographic package test technology.

News from Kulicke and Soffa Industries (15 September 2005)

Taiwanese assembler orders wire bonders

Siliconware Precision Industries has placed a series of purchase orders for K and S wire bonders for delivery to its Taichung, Taiwan facility.

News from Kulicke and Soffa Industries (14 September 2005)

Alliance aims to align wire bonding portfolios

Kulicke and Soffa Industries and Microbonds are working on a joint process development project.

News from Kulicke and Soffa Industries (25 July 2005)

Capillary cuts wire bonding defects

Kulicke and Soffa Industries has developed a new capillary called Arcus to increase yields and productivity in demanding packaging applications.

News from Kulicke and Soffa Industries (13 July 2005)

Semiconductor equipment pioneer Soffa dies

Albert Soffa, cofounder of Kulicke and Soffa Industries and pioneer of the first wire bonder, died on Sunday 10th April 2005, aged 84.

News from Kulicke and Soffa Industries (13 April 2005)

Stud bumper boasts 87% speed improvement

The ATPremier is an advanced stud bumping machine claimed to offer many technology advancements specifically designed for the growing flip chip market.

News from Kulicke and Soffa Industries (17 March 2005)

Ball bonders engineered for higher productivity

Kulicke and Soffa Industries has added two new automatic ball bonders to its highly successful Maxum series platform, which already boasts more than 8000 units installed worldwide.

News from Kulicke and Soffa Industries (17 March 2005)

Wedge bonder technology sold off

Kulicke and Soffa Industries has sold its wedge bonder technology to Orthodyne Electronics in Irvine, California.

News from Kulicke and Soffa Industries (17 March 2005)

New plant supports Taiwanese probe card demands

Kulicke and Soffa Industries has officially opened its new state-of-the-art probe card manufacturing facility in Hsin Chu, Taiwan.

News from Kulicke and Soffa Industries (20 October 2004)

Gold bonding wire boosts device reliability

Radix is a new gold bonding wire specifically engineered for higher intermetallic stability to improve reliability in the most demanding wire bonding applications.

News from Kulicke and Soffa Industries (15 September 2004)

Capillary guide simplifies tool selection

A new comprehensive capillary catalogue will assist packaging assembly engineers in learning more about the latest technological advances in capillary designs.