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    <title>RSS News Feed for Kulicke and Soffa Industries - from Electronicstalk</title>
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    <description>Kulicke and Soffa Industries news releases on Electronicstalk</description>
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    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Sat, 22 Nov 2008 08:00:00 UT</pubDate>
    <lastBuildDate>Sat, 22 Nov 2008 08:00:00 UT</lastBuildDate>
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    <item>
      <title>Wire bonders move to next generation</title>
      <description>Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.</description>
      <pubDate>Tue, 18 Mar 2008 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul126.html</link>
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    <item>
      <title>Bonding wire for ICs</title>
      <description>MaxSoft bonding wire has fine speed and cost-effectiveness ratings.</description>
      <pubDate>Mon, 30 Apr 2007 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul125.html</link>
    </item>
    <item>
      <title>Die bonders improve productivity</title>
      <description>KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company.</description>
      <pubDate>Wed, 25 Apr 2007 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul124.html</link>
    </item>
    <item>
      <title>Capillary ensures greater second bond quality</title>
      <description>Kulicke and Soffa Industries has developed the Cupraplus that supports highly consistent and stable fine wire second bonds, while maintaining the quality of the overall wire bonding process.</description>
      <pubDate>Thu, 14 Dec 2006 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul123.html</link>
    </item>
    <item>
      <title>Boulanger takes charge of die bonder operations</title>
      <description>Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland.</description>
      <pubDate>Mon, 20 Nov 2006 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul122.html</link>
    </item>
    <item>
      <title>Kulicke and Soffa to acquire Alphasem</title>
      <description>Kulicke and Soffa Industries has signed an agreement to acquire Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International.</description>
      <pubDate>Fri, 13 Oct 2006 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul121.html</link>
    </item>
    <item>
      <title>Wire bonder is named as best product</title>
      <description>Kulicke and Soffa Industries has received the prestigious Editors' Choice Best Product Award, presented annually by Semiconductor International magazine, for its Maxum Ultra wire bonder.</description>
      <pubDate>Tue, 11 Jul 2006 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul120.html</link>
    </item>
    <item>
      <title>K and S to divest test operations</title>
      <description>Kulicke and Soffa Industries is planning to tighten its focus on semiconductor assembly equipment and materials and create value for its shareholders.</description>
      <pubDate>Mon, 06 Feb 2006 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul119.html</link>
    </item>
    <item>
      <title>Chinese plant expands into blades and sockets</title>
      <description>Kulicke and Soffa Industries has expanded its facility in Suzhou, China to become fully operational in its manufacturing capabilities to produce both dicing hub blades and test sockets.</description>
      <pubDate>Fri, 16 Sep 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul118.html</link>
    </item>
    <item>
      <title>Package test technology wins award</title>
      <description>Kulicke and Soffa Industries has won a 2005 Advanced Packaging Award in the Semiconductor Assembly and Test Services category for its new Quatrix photolithographic package test technology.</description>
      <pubDate>Thu, 15 Sep 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul117.html</link>
    </item>
    <item>
      <title>Taiwanese assembler orders wire bonders</title>
      <description>Siliconware Precision Industries has placed a series of purchase orders for K and S wire bonders for delivery to its Taichung, Taiwan facility.</description>
      <pubDate>Wed, 14 Sep 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul116.html</link>
    </item>
    <item>
      <title>Alliance aims to align wire bonding portfolios</title>
      <description>Kulicke and Soffa Industries and Microbonds are working on a joint process development project.</description>
      <pubDate>Mon, 25 Jul 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul115.html</link>
    </item>
    <item>
      <title>Capillary cuts wire bonding defects</title>
      <description>Kulicke and Soffa Industries has developed a new capillary called Arcus to increase yields and productivity in demanding packaging applications.</description>
      <pubDate>Wed, 13 Jul 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul114.html</link>
    </item>
    <item>
      <title>Semiconductor equipment pioneer Soffa dies</title>
      <description>Albert Soffa, cofounder of Kulicke and Soffa Industries and pioneer of the first wire bonder, died on Sunday 10th April 2005, aged 84.</description>
      <pubDate>Wed, 13 Apr 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul113.html</link>
    </item>
    <item>
      <title>Stud bumper boasts 87% speed improvement</title>
      <description>The ATPremier is an advanced stud bumping machine claimed to offer many technology advancements specifically designed for the growing flip chip market.</description>
      <pubDate>Thu, 17 Mar 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul110.html</link>
    </item>
    <item>
      <title>Ball bonders engineered for higher productivity</title>
      <description>Kulicke and Soffa Industries has added two new automatic ball bonders to its highly successful Maxum series platform, which already boasts more than 8000 units installed worldwide.</description>
      <pubDate>Thu, 17 Mar 2005 08:00:00 UT</pubDate>
      <category>Kulicke and Soffa Industries</category>
      <link>http://www.electronicstalk.com/news/kul/kul111.html</link>
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