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Kulicke and Soffa Industries
All articles from Kulicke and Soffa Industries
Wire bonders move to next generation
Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.
News from Electronicstalk, 18 March 2008
Bonding wire for ICs
MaxSoft bonding wire has fine speed and cost-effectiveness ratings.
News from Electronicstalk, 30 April 2007
Die bonders improve productivity
KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company.
News from Electronicstalk, 25 April 2007
Capillary ensures greater second bond quality
Kulicke and Soffa Industries has developed the Cupraplus that supports highly consistent and stable fine wire second bonds, while maintaining the quality of the overall wire bonding process.
News from Electronicstalk, 14 December 2006
Boulanger takes charge of die bonder operations
Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland.
News from Electronicstalk, 20 November 2006
Kulicke and Soffa to acquire Alphasem
Kulicke and Soffa Industries has signed an agreement to acquire Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International.
News from Electronicstalk, 13 October 2006
Wire bonder is named as best product
Kulicke and Soffa Industries has received the prestigious Editors' Choice Best Product Award, presented annually by Semiconductor International magazine, for its Maxum Ultra wire bonder.
News from Electronicstalk, 11 July 2006
K and S to divest test operations
Kulicke and Soffa Industries is planning to tighten its focus on semiconductor assembly equipment and materials and create value for its shareholders.
News from Electronicstalk, 6 February 2006
Chinese plant expands into blades and sockets
Kulicke and Soffa Industries has expanded its facility in Suzhou, China to become fully operational in its manufacturing capabilities to produce both dicing hub blades and test sockets.
News from Electronicstalk, 16 September 2005
Package test technology wins award
Kulicke and Soffa Industries has won a 2005 Advanced Packaging Award in the Semiconductor Assembly and Test Services category for its new Quatrix photolithographic package test technology.
News from Electronicstalk, 15 September 2005
Taiwanese assembler orders wire bonders
Siliconware Precision Industries has placed a series of purchase orders for K and S wire bonders for delivery to its Taichung, Taiwan facility.
News from Electronicstalk, 14 September 2005
Alliance aims to align wire bonding portfolios
Kulicke and Soffa Industries and Microbonds are working on a joint process development project.
News from Electronicstalk, 25 July 2005
Capillary cuts wire bonding defects
Kulicke and Soffa Industries has developed a new capillary called Arcus to increase yields and productivity in demanding packaging applications.
News from Electronicstalk, 13 July 2005
Semiconductor equipment pioneer Soffa dies
Albert Soffa, cofounder of Kulicke and Soffa Industries and pioneer of the first wire bonder, died on Sunday 10th April 2005, aged 84.
News from Electronicstalk, 13 April 2005
Stud bumper boasts 87% speed improvement
The ATPremier is an advanced stud bumping machine claimed to offer many technology advancements specifically designed for the growing flip chip market.
News from Electronicstalk, 17 March 2005
Ball bonders engineered for higher productivity
Kulicke and Soffa Industries has added two new automatic ball bonders to its highly successful Maxum series platform, which already boasts more than 8000 units installed worldwide.
News from Electronicstalk, 17 March 2005
Wedge bonder technology sold off
Kulicke and Soffa Industries has sold its wedge bonder technology to Orthodyne Electronics in Irvine, California.
News from Electronicstalk, 17 March 2005
New plant supports Taiwanese probe card demands
Kulicke and Soffa Industries has officially opened its new state-of-the-art probe card manufacturing facility in Hsin Chu, Taiwan.
News from Electronicstalk, 20 October 2004
Gold bonding wire boosts device reliability
Radix is a new gold bonding wire specifically engineered for higher intermetallic stability to improve reliability in the most demanding wire bonding applications.
News from Electronicstalk, 15 September 2004
Capillary guide simplifies tool selection
A new comprehensive capillary catalogue will assist packaging assembly engineers in learning more about the latest technological advances in capillary designs.
News from Electronicstalk, 22 July 2004
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