Wire bonders are a hit in the East

Kulicke and Soffa Industries has shipped its Nu-Tek wire bonders to a semiconductor manufacturer in Thailand.

Kulicke and Soffa Industries has shipped its Nu-Tek wire bonders to a semiconductor manufacturer in Thailand.

This order represents another customer confirmation of the superior performance and cost benefits derived from the latest K and S wire bonder model.

The Nu-Tek bonders will be used in the manufacture of low pin count QFN packages for the telecommunication industry.

The Nu-Tek is an automatic ball bonder designed specifically to provide the highest yield and productivity in high-density matrix (HDM) and small outline (SO) semiconductor packages.

It supports the requirements of these packages by combining speed, the industry's largest table travel, optimum looping capability, and software flexibility.

The company has previously received purchase orders for Nu-Tek bonders from several Chinese manufacturers of SOIC and SOT semiconductor packages, with deliveries scheduled in the March 2003 quarter.

These orders are the first entry into this new market segment, not previously served by K and S.

Jack Belani, Vice President of Marketing, commented on the orders, "This new platform is already receiving good customer acceptance since its introduction during the last calendar quarter of 2002.

We are pleased to be moving into new customer accounts and markets with equipment specifically tailored to meet those packaging needs.

The high throughput of this machine combined with the ability to handle the wider, 70mm strip format will significantly lower the overall cost of manufacturing SO packages for our customers".

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