Product category:
IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries
Edited by the Electronicstalk Editorial
Team on 15 July 2003
National signs up for wire bonders
National Semiconductor has signed a volume purchase agreement (VPA) for the purchase of Maxum wire bonders.
National Semiconductor has signed a volume purchase agreement (VPA) for the purchase of Maxum wire bonders The agreement defines an agreed price for the wire bonders which will be delivered to National's facilities in Singapore and Malaysia
This article was originally published on Electronicstalk on 13 Jan 2004 at 8.00am (UK)
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In addition, the corporate VPA provides that K and S will be the exclusive supplier of wire bonders over the next 12 months.
"Based on our current assessment, the K and S Maxum wire bonder and K and S process support is the most suitable for our needs.
The Maxum wire bonder is a versatile platform that gives us manufacturing capability over a wide range of packages with the best combination of output and yield", Said Wan Choong Hoe, General Manager of National Semiconductor, Singapore.
Jack Belani, Vice President of Marketing at K and S, stated, "This agreement with National Semiconductor begins a refreshed relationship between our two companies.
It allows us to codevelop a rolling forecast and plan for wire bonding equipment requirements across all the NS factories.
The result is a just-in-time supply of new equipment, without delays caused by normal price and availability negotiations.
And of course, K and S is very proud to be selected as National Semiconductor's exclusive supplier for wire bonders.
It is perhaps the highest award to receive from a customer".
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