Product category:
IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries | Subject: Maxumplus
Edited by the Electronicstalk Editorial
Team on 13 January 2004
Fine-pitch bonder sets new speedy
standard
The Maxumplus is an ultra-high-speed ball bonder for all types of ultra-fine-pitch applications including 35 micron inline pitch.
The Maxumplus is an ultra-high-speed ball bonder for all types of ultra-fine-pitch applications including 35 micron inline pitch Based on the technology of K and S' market-leading Maxum IC ball bonder, the Maxumplus establishes a new benchmark for fine pitch wire bonders by delivering bond placement accuracy of 2.5um, at speeds up to 10% faster than the Maxum
This article was originally published on Electronicstalk on 21 Jul 2004 at 8.00am (UK)
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An improved servo control system for the x-y table reduces wire cycle times to 63.0ms.
Performance is maintained for the largest bonding area available in the market - 56 x 66mm.
Precision-touch bond-head technology delivers optimum bond force control.
Advanced teaching and calibration software improves overall accuracy to 2.5um.
The Maxumplus also incorporates a reduced-friction wire feed path with the capability to handle wires down to 15um diameter.
S-Scan advanced imaging technology increases overall process productivity while enhancing the performance of all vision operations by using field-proven vision engine and algorithms.
The uT-Sonics transducer delivers optimal dynamic response with the lowest impact forces and ultrasonic energy levels, minimising pad disturbance while maintaining highest shear values.
A Precision-Arc EFO system, that enhances EBC (electronic ball control) delivery, combines with a new small ball detection capability to provide the highest repeatability in FAB (free air ball) formation available in the market.
The Maxumplus offers a variety of wire bonding processes including standard loop, GBA2, worked loop, J-wire loop, SSB and other fine pitch processes.
It works with a variety of bonding wire such as AW-66, AW-99 and AW-99X.
This new IC ball bonder is engineered to work with the new K and S' CIC capillary to address specific applications.
As the fastest wire bonder in the world with 35um capability, the Maxumplus leads the industry in productivity and sets the standard for handling the most challenging applications in production today.
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