Product category:
IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries | Subject: Blade Pro
Edited by the Electronicstalk Editorial
Team on 21 July 2004
Software simplifies wafer blade
specification
Kulicke and Soffa Industries has developed a novel online hub blade software package designed for faster and easier blade selection.
Kulicke and Soffa Industries has developed a novel online hub blade software package designed for faster and easier blade selection Using Blade Pro software, process engineers can enter supply specific manufacturing process parameters and required blade features to identify the best blade for the highest productivity and yield
This article was originally published on Electronicstalk on 13 Jan 2004 at 8.00am (UK)
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Jack Belani, Vice President of K and S Marketing and Business Units, states: "Our customers now can design and generate samples right from their own computer".
"Plus, they can access their personal Blade Pro account from any computer with a simple Internet connection".
This new web-based hub blade software is offered at no charge to any K and S blade customer.
It will be constantly updated with new blade data to provide the most current blade selections for today's applications.
Dr Ilan Hader, Vice President of Bonding Materials at Kulicke and Soffa, notes: "Blade selection is more challenging due to new wafer developments like copper, low-k dielectric and higher I/O densities".
"Blade Pro software processes any customer data to automatically select the best performing blade to allow higher dicing throughput".
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