Product category:
IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries | Subject: Capillaries
Edited by the Electronicstalk Editorial
Team on 22 July 2004
Capillary guide simplifies tool
selection
A new comprehensive capillary catalogue will assist packaging assembly engineers in learning more about the latest technological advances in capillary designs.
A new comprehensive capillary catalogue will assist packaging assembly engineers in learning more about the latest technological advances in capillary designs Additionally, the new capillary catalogue includes a new advanced wire bonding technical section designed to solve process challenges such as bonding over active circuitry, copper and stack-die applications relating to capillary designs
This article was originally published on Electronicstalk on 13 Jan 2004 at 8.00am (UK)
Related stories
Fine-pitch bonder sets new speedy standard
The Maxumplus is an ultra-high-speed ball bonder for all types of ultra-fine-pitch applications including 35 micron inline pitch.
Jack Belani, Vice President of K and S Marketing and Business Units, commented: "We see more and more customers struggling with ultra-fine-pitch applications such as 35um".
"Our new capillary guide is designed as a tool to assist in proper capillary selection to achieve maximum yields".
The new catalogue also features an easy-to-use part numbering selection process guide, which is tied into the K and S e-commerce site for capillaries.
Dr Ilan Hader, Vice President of Bonding Materials at Kulicke and Soffa, states: "Faster time to market is a real challenge that our customer face each day".
"This capillary catalogue is designed to select the right capillary for the right application".
• Kulicke and Soffa Industries: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

