Product category:
IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries
Edited by the Electronicstalk Editorial
Team on 13 October 2006
Kulicke and Soffa to acquire Alphasem
Kulicke and Soffa Industries has signed an agreement to acquire Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International.
Kulicke and Soffa Industries has signed an agreement to acquire Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International The purchase price is US $30 million, subject to a working capital adjustment
This article was originally published on Electronicstalk on 25 Apr 2007 at 8.00am (UK)
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The acquisition is expected to close on or about 3rd November 2006, and is subject to customary closing conditions.
K and S Equipment Segment Vice President, Christian Rheault, commented on the agreement: "The acquisition of Alphasem is a natural extension of K and S's core equipment business into die bonding equipment".
"The die bonding process precedes the wire bonding step in semiconductor chip manufacturing, and normally utilises adjacent floor space and a common engineering team".
"This supplier consolidation will enhance our ability to provide solutions to our customers across a greater span of the semiconductor assembly process".
He added: "According to VLSI Research, the die bonder market was $520 million in calendar year 2005".
"The Alphasem team has good market presence, provides strong engineering and process expertise, and has demonstrated a long standing commitment to the die bonder market".
"The combined Alphasem/K and S organisation will allow us to better serve our customers' needs while further expanding our overall semiconductor assembly equipment market presence".
Rheault concluded: "Wire bonders and die bonders share many common functions, software features, subassemblies, and components".
"We believe joining the engineering and manufacturing expertise of Alphasem and K and S will yield superior equipment platforms".
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