Product category:
IC and Hybrid Processing Equipment
News Release from: Kulicke and Soffa Industries | Subject: IConnPS and ConnXPS
Edited by the Electronicstalk Editorial
Team on 18 March 2008
Wire bonders move to next generation
Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.
Kulicke and Soffa Industries has released two next-generation wire bonders at Semicon China, in Shanghai The first is the new IConnPS high performance wire bonder, which will replace the current market-leading Maxumultra
This article was originally published on Electronicstalk on 13 Jan 2004 at 8.00am (UK)
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The name IConnPS comes directly from its function of IC interconnect.
It offers the highest performance in wire bond packaging assembly, with features that address the advanced product roadmaps of K and S customers including: +/-2.0um accuracy for sub35um ultra-fine-pitch requirements; new advanced looping processes; an automatic self-teaching bond integrity test system (Auto BITS); and programmable focus optics for complex stacked die packages.
The second bonder being announced is the new ConnXPS high speed wire bonder, which replaces the Maxumelite.
The ConnXPS is engineered to provide unsurpassed throughput for manufacturing lower pin count ICs and LEDs, in the cost performance part of the assembly market.
Its features include: +/-3.0um accuracy; look-ahead vision algorithms to align and bond simultaneously; and programmable red/blue illumination.
The PS superscript in both these wire bonders means they will be part of the company's new Power Series product line.
This series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.
The Power Series will also be represented by a new product line symbol - a form of the Chinese character "Li", which means power and strength throughout Asia.
Common features for both the IConnPS and ConnXPS include: a larger 80mm bondable area and advanced motion control system; a dual frequency transducer; and a programmable power supply system.
Scott Kulicke, Chairman and CEO of K and S, explains: "These next generation wire bonders are the most thoroughly tested products in our history, so they are ready for production right out of the box".
"In addition to the accuracy, looping, and reliability tests, we ran customers' Maxumultra bond programs directly on IConnPS with excellent results".
"We confirmed the bonding and looping quality at the increased speed".
The customer qualification process for the two Power Series wire bonders started this quarter, and will be followed by initial production shipments to customers in the June quarter.
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