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University looks into MMIC packaging

A Labtech Microwave product story
Edited by the Electronicstalk editorial team Feb 12, 2004

Labtech has linked up with Cardiff University on a PhD project designed to support the development, marketing and sales of its products.

Labtech has linked up with Cardiff University on a PhD project designed to support the development, marketing and sales of its products.

The university is providing scientific support for flexible monolithic microwave integrated circuit (MMIC) packaging technology developed and manufactured at Labtech's high-tech headquarters in Presteigne.

The three-year research project aims to develop an understanding of the packaging technology, explore its capabilities and apply it to the packaging of RF and microwave circuits.

Labtech will supply a set of manufactured packages for the university to obtain the basic performance of the new technology.

The results will then be made available to Labtech's growing customer base.

A deeper understanding of the performance tradeoffs of the technology will also be undertaken, such as coupling between lines, bond wires and the use of different substrates, sealing methods and mounting techniques.

"The project with Cardiff University further confirms Labtech's continued development of our highly flexible MMIC packaging technology launched during 2002", said John Priday, Labtech's Engineering and Quality Executive.

"We have seen tremendous interest from the market place and hope the scientific support from Cardiff University helps Labtech consolidate the opportunities currently ongoing".

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