Conference paper describes novel MMIC package

Labtech has collaborated with TNO Physics and Electronics Laboratory to write a technical paper that will be presented at the European Microwave Conference in Amsterdam.

Labtech has collaborated with TNO Physics and Electronics Laboratory (TNO-FEL) in Holland to write a technical paper that will be presented at the European Microwave Conference in Amsterdam between 11th and 15th October 2004.

Focusing on a novel low cost SMD package for high power monolithic microwave integrated circuits (MMICs), the paper has been written by Marc van Heijningen, of TNO-FEL in The Hague assisted by John Priday, Labtech's Engineering and Quality Executive.

The two companies are members of a European Union IST funded collaborative programme called SMACKS (surface mount assembly for communications Ka band systems), which has helped to develop this novel packaging approach.

"This special SMD package has a very low thermal resistance and low parasitic ground inductance", revealed Priday.

"Measurement results of a 1W 40GHz HPA before and after packaging are presented".

"The gain reduction at 40GHz caused by the package is only 1dB and allows power dissipation of at least 7W".

The technical paper is perfectly timed as Labtech, which supplies the global Telecommunications, Defence and Space markets, will be showcasing its hi-tech capability at the European Microwave Show from 12th to 14th October.

The innovative company, which has state-of-the-art facilities at Presteigne, Wales, UK, is looking to build on the success achieved at the Microwave Theory and Techniques Society (MTT-S) exhibition during Microwave Week in Fort Worth, Texas in June.

It will also be exhibiting at The 37th International Symposium on Microelectronics in Long Beach, California from 16th to 18th November.

"Following the great interest in our MMIC packaging technology in Fort Worth, we are looking forward to promoting our range of services in Amsterdam and Long Beach", said Labtech's Sales and Marketing Director Bob Lowther.

Labtech has developed MMIC custom packaging solutions using organic substrates as a low cost alternative to existing technologies.

Offering low cost NRE and tooling, the solutions are targeted at Ka/Ku band applications and the optical components market.

New electroplating techniques to thicken the ground metal plate for high power packaging versions have been developed by the company along with interesting motherboard solutions for MMIC integration, utilising mixed dielectric and metal core/backing techniques.

Labtech's MIC assembly facility, housed in a Class 10,000 ESD protected clean room, uses chip and wire bond techniques.

The company is able to bond directly to PTFE laminates using gold, ribbon and aluminium wires.

Employing a workforce of around 100, Labtech has recently secured the new quality management standard ISO9001: 2000 and the prestigious ISO14001 environmental award from the British Standards Institution, reflecting a commitment to quality throughout the company.

Back to top