Product category:
Boards and Backplanes
News Release from: Labtech Microwave | Subject: MMIC packaging
Edited by the Electronicstalk Editorial
Team on 29 October 2004
MMIC packaging expertise on show in
California
Labtech will be showcasing its high-tech capabilities at the 37th International Symposium on Microelectronics in Long Beach, California from 16th to 18th November 2004.
Labtech will be showcasing its high-tech capabilities at the 37th International Symposium on Microelectronics in Long Beach, California from 16th to 18th November 2004 The symposium, sponsored by the International Microelectronics and Packaging Society (IMAPS), covers the latest developments in microelectronics and will have over 200 companies exhibiting
This article was originally published on Electronicstalk on 23 Sep 2008 at 8.00am (UK)
Related stories
Labtech Microwave releases LMS8XX switch drivers
Labtech Microwave, a manufacturer of microwave component technology, has released the LMS8XX series of switch drivers.
Passives provide missing microwave link
Power divider/combiners, directional couplers and hybrid couplers target satellite, commercial, radio and air traffic communications industries.
It will be the first time that Labtech, one of the world's leading manufacturers of microwave printed circuit boards for the global telecommunications, defence and space markets, has attended the IMAPS exhibition.
The company will be represented by John Priday, Engineering and Quality executive and Mark Gullotti, National Sales Manager for North America at Booth 258.
The two will be promoting Labtech's cutting edge monolithic microwave integrated circuit (MMIC) packaging technology and microelectronics assembly services.
Priday recently collaborated with Marc van Heijningen, of TNO Physics and Electronics Laboratory (TNO-FEL) in Holland, to produce a technical paper on a novel low cost SMD package for high power MMICs that was well received at the recent European Microwave Conference in Amsterdam.
Both companies are members of a European Union IST funded collaborative programme called SMACKS (surface mount assembly for communications Ka band systems), which evaluated various high frequency MMIC packaging options.
"The location of the IMAPS exhibition is important to Labtech as many of our customers in the commercial, space and defence markets are based in California", said Labtech's Sales and Marketing Director Bob Lowther.
"It's one of the main symposiums for covering the packaging side of our activity and supplements the microwave shows that we attend in the United States and Europe".
"We have attracted a lot of interest in our MMIC packaging technology at previous shows this year and look forward to promoting our range of services in Long Beach".
"As our packaging technology has moved on to new levels, new business opportunities have been created".
Labtech has developed MMIC custom packaging solutions using organic substrates as a low cost alternative to existing technologies.
Offering low cost NRE and tooling, the solutions are targeted at Ka/Ku band applications and the optical components market.
• Labtech Microwave: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
