Dicing services take in 300mm wafers

Loadpoint has added NanoAce 300mm diameter capacity high-precision dicing saws to its subcontract facility in Swindon, UK.

Loadpoint has added NanoAce 300mm diameter capacity high-precision dicing saws to its subcontract facility in Swindon, UK.

The versatile NanoAce dices materials including alumina, BGA mouldings, ceramic, glass, lead zirconate titanate, fibre board and silicon, and can be controlled in four axes (x, y, z, and theta).

Loadpoint's customers use the wafer dicing subcontract facility to develop dicing processes for separation of ICs, LEDs, MEMS and other devices.

The facility benefits from both the extensive dicing experience of the company's staff and the versatility of its machines, which are designed and built in-house.

With the development of wafer level packaging, dicing saws as adaptable as the NanoAce are set to become more and more valuable to product development.

Loadpoint's experience in dicing has earned it a place among some of Europe's leading semiconductor manufacturers who are currently researching the process technology that will enable production of the next generation of ultra-thin ICs.

Company Director John Sweet says: "For semiconductor dicing, high precision diamond saws like the NanoAce are the most effective option for cost and productivity.

Now we are pushing back the boundaries of this field of production engineering to ever finer levels of finish and quality".

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